PRINTED CIRCUIT BOARDS (PCB)
YEARS LONG PROVED QUALITY, EXPERTISE EVALUATION
From prototypes to large series, up to 42 layers, buried vias, 2mil line/gap, flex, rigid, …
High Density Interconnect PCBs (HDI)
- impedance control
- blind or buried vias
- POV Pad-On-Via
- laser drilled
- ENIG, HASL, ENEPIG, OSP, Ag
Metal core (AL) PCBs
- single layer, double layer, vias
- Copper thickness up to 105um
- Gold or OSP
- 1mm, 1.5mm, 2mm
IceBerg
- signal and power plane combination
- cost saving
Flex / Flex-rigid
- up to 14 layers
- material combination
- laser routing
- galvanic Gold
Limits
| number of layers | : | 42 |
| thickness of PCB | : | 0.05mm – 7.62mm |
| Copper foil thickness | : | 5μm – 210μm |
| line / gap | : | 50μm / 50μm |
| min. via diameter | : | 0.1mm |
| max. dimensions | : | 580mm x 700mm |