PRINTED CIRCUIT BOARDS (PCB)

YEARS LONG PROVED QUALITY, EXPERTISE EVALUATION

From prototypes to large series, up to 42 layers, buried vias, 2mil line/gap, flex, rigid, …

High Density Interconnect PCBs (HDI)

  • impedance control
  • blind or buried vias
  • POV Pad-On-Via
  • laser drilled
  • ENIG, HASL, ENEPIG, OSP, Ag

Metal core (AL) PCBs

  • single layer, double layer, vias
  • Copper thickness up to 105um
  • Gold or OSP
  • 1mm, 1.5mm, 2mm

IceBerg

  • signal and power plane combination
  • cost saving

Flex / Flex-rigid

  • up to 14 layers
  • material combination
  • laser routing
  • galvanic Gold

Limits

number of layers:42
thickness of PCB:0.05mm – 7.62mm
Copper foil thickness:5μm – 210μm
line / gap:50μm / 50μm
min. via diameter:0.1mm
max. dimensions:580mm x 700mm